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solder over the pads and the hole walls. The operation sounds simple, but it requires constant fine-tuning and maintenance of the hot-air solder coater leveler; otherwise, some holes may become heavily clogged with solder and are then useless for component insertion. One advantage of the pattern-plating method over the panel-plating method is in etching. The pattern-plating method needs to etch only the base copper. The use of ultrathin copper foil (UTC), which is usually 1 8 or 1 4 oz thick, offers a real advantage. However, as long as electroplating is used, the pattern-plating method cannot escape from a current distribution problem, regardless of the thickness of the base foils. The panel-plating method by electroplating suffers from the same problem but to a lesser degree. Good current distribution is very difficult to achieve when the boards are not of the same size or type, and particularly if some have large ground planes on the outer faces being plated. When the board has a few holes in an isolated area remote from the bulk of the circuitry, these tend to become overplated, making component lead insertion difficult during assembly. To minimize this current distribution problem, various countermeasures are practiced, such as special anode position, anode masking, agitation, and plating thieves. But none of these offers a decisive solution to the distribution problem, and they are extremely difficult to implement flexibly and effectively in a large plating operation, where a large number of product mixes have to be handled all the time. asp.net upc-a UPC-A . NET Control - UPC-A barcode generator with free . NET ...
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6 Apr 2005 ... Demonstrates a method to draw UPC-A barcodes using C#. ... NET 2003 - 7.87 Kb. Image 1 for Drawing UPC-A Barcodes with C# ... Another advantage of the pattern-plating method is its ability to form padless micro-via holes of a diameter ranging from 0.012 to 0.016 in. Micro-via holes enable better usage of conductor channels, thereby increasing the connective capacity of the board. 5.8.3 Panel Plating In the panel-plating method, there are two variations for finishing the board after the panel is plated with electrolytic copper to the desired thickness. In the hole-plugging method, the holes are filled with alkaline-etchable ink to protect the hole walls from being etched; this is used in conjunction with screened etch resist. In the other method, called tent-and-etch or simply tenting, the copper in the hole is protected from etching by covering the hole or tenting with dry film, which is also used as an etch resist for conductors on the panel surface. The simplified sequence of the panel-plating method is as follows (see Fig. 5.6): 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. Catalyzing Thin electroless copper deposition (0.0001 in) Electroplating copper (0.001 to 0.0012 in) Hole plugging with alkaline-resolvable ink; tenting (dry film lamination) Screen-print etching resist (conductor pattern); photoexpose the panel for conductor pattern Etching copper Stripping etching resist Solder mask Solder coater leveler (optional) Final fabrication and inspection asp.net upc-a Barcode UPC-A - CodeProject
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NET UPC-A Generator Controls to generate GS1 UPC-A barcodes in VB. NET , C# applications. Download Free Trial Package | Developer Guide included ... The panel-plating method is ideal for bare copper board. However, it is a difficult way to make padless via holes, which are becoming more popular. Generally, the conductor width of 0.004 in is considered to be the minimum realizable by this method for mass production. Although the use of the panel-plating method in the United States and western Europe is limited, nearly 60 percent of the PTH boards in Japan are manufactured by this method. 5.8.4 Additive Plating Plated-through holes can be formed by additive (electroless) copper deposition, of which there are three basic methods: fully additive, semiadditive, and partially additive. Of these, semiadditive involves pattern electroplating for PTHs with very thin surface copper, but the other two form PTHs solely by electroless copper deposition. The additive process has various advantages over the subtractive process in forming fineline conductors and PTHs of high aspect ratio. A detailed account of the additive process is given in Chap. 31. asp.net upc-a UPC-A Barcode Generator for ASP . NET Web Application
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