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solderability defect) It should be noted that some 100 percent tin surface finishes and other lead-free finishes have such a smooth surface that adhesion of sufficient flux for a five or ten second test is not possible and the de-wetting being recorded is a function of flux consumption rather than a fundamental solderability test. 5. The output of the wetting balance provides hard data which then gives the engineer the ability to perform a statistical comparison of both the population being tested and the other production batches from the same supplier or off the same plating line. 6. The impact of changing fluxes This is especially useful for lead-free assembly development, given the myriad of surface finishes the assembly engineer is now faced with. 7. The impact of stressing (steam exposure or dry bakes or temperature/humidity) on the robustness of the plating can easily be determined as a function of reduced wetting forces or increased wetting times. The importance of the previous information cannot be over stated as the industry transitions to Pb-free assembly. A test that provides everything in the previous list as its output can improve a process. It can also be used to improve a supplier or disqualify a supplier, select a flux or a surface finish, and/or the best combination of both to minimize defects. birt barcode extension BIRT Barcode Generator - OnBarcode
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was to extend BIRT by writing an plugin implementing barcode4j (http://barcode4j.sourceforge.net/). My second idea was that such a common All the previous information provided has been based on the use of a solder bath for testing when using a wetting balance There is another test method possible for the wetting balance known as the globule test method, in which a pellet of solder of known weight, for example 25 mg, or for size, 4 mm is placed onto a solder iron tip of suitable size that is encapsulated in a non-wettable aluminum block The solder pellet is fluxed, melts on the heated tip and then forms a globule into which the part to be tested is immersed Historically, the globule was designed for testing wire or leads of a component that are circular in cross section. birt barcode tool How to add barcodes using free Eclipse BIRT barcode generator ...
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Mar 13, 2014 · ... barcodes to a eclipse Birt Report. ... Barcodes for Edlipse Birt , tutorial ... Overview of ...Duration: 2:47 Posted: Mar 13, 2014 In that process, the sample to be tested was positioned horizontally to the globule and then, using a microscope and a stop watch, the time needed to reform the globule after wetting the wire was recorded Similar to the mathematics explaining the physics of soldering in Fig 421, using the globule for testing components of circular cross sectional areas can be logically explained The use of the globule test method for other components is very common The output of the globule test is in mN and consistent placement of the sample, relative to its immersion point in the globule, is critical if variation due to the test is to be minimized Three globule sizes are popular: 4mm, 25mm, and 1mm, and these are chosen based on the size of the component to be soldered. birt barcode free Generating & Printing Barcodes in Eclipse BIRT | Tutorial ...
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Free trial version download for Eclipse BIRT Report plugin. Generate best barcode images with BizCode barcode generator for BIRT Report plug-in. Placing a large chip endcap into the smallest globule will provide insufficient solder to totally wet the part causing artificially low values to be recorded Placing the part offset to the globule will affect the true immersion depth that the machine has been preprogrammed to; again providing insufficient solder to wet the part resulting in low forces Modern globule test machines use video and programmable XY stages to consistently position the sample in the same place relative to the solder globule After each test, the globule needs to be replaced with a fresh pellet in order to maintain the same dimensions This is necessary so that the immersion depth and solder available for wetting are consistent Because of the need to prevent the globule from oxidizing so that it doesn t impact the solderability results, it must be fluxed with a rosin flux that does not evaporate. Testing with fluxes other than rosin-based results in a mix of flux types being used If a VOC or VOCfree flux is used to prevent oxidation of the globule, it will evaporate rapidly and produce false readingsThe ANSI-JSTD-002 has detailed component-orientation diagrams to help minimize variation due to placement error when using the globule test method.. The PCB surface finishes all have their unique wetting curves and shapes. Understanding what a good curve should look like for a given surface finish is very important, especially when using the wetting balance to detect subtle changes that are process indicators of potential problems to come. A test that does not provide numerical data will never be able to achieve this. It is very important that the solderability test, including any stressing that may be imparted on the deposit, be representative of the failure mode that the surface finish finally succumbs to naturally over time.The use of steam to stress a deposit other than a lead-bearing one is not to be used; the recommended stressing is eight hours of exposure to 72 C/85 percent R.H. Doing so, you will reap bene ts beyond what you ever imagined.. 42.7.1 Typical Solderability Failure Modes By Surface Finishes The typical failure modes for the most common PCB surface finishes are listed next. It should be noted that these wetting curves are for PWB s that were not packaged and purposefully exposed to the environment for a worst case scenario. PWB s correctly packaged and stored will last a lot longer in the majority: birt barcode generator BIRT Barcode Plugin for eclipse BIRT versions 2.x, 3.x and 4.x
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