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This data is used by the checking programs to ensure that the points in a net are ordered properly for high-speed performance or to ensure that a net has the correct kinds of pins in it 14612 Functional Models CAE tools that simulate the operation of a PCB require a library of models that describe how each part operates logically These are functional models Functional models do not contain information about propagation delay or rise times needed to verify that timing rules are complied with Functional models are often used to configure emulators 14613 Simulation Models Simulation models are extended versions of functional models They contain all the functional information as well as detailed information about path delays through a part and rise and fall times They are used to ensure that worst-case timing conditions result in a properly operating design 146.

2 PCB Characteristics One of the sets of data required by the physical layout system is a description of the PCB or its physical characteristics This includes its size, number and kinds of layers, thicknesses of insulating layers, copper thicknesses, and areas that are not available for parts or traces 1463 Spacing and Width Rules To ensure compliance with manufacturing and transmission line rules, the trace widths and trace spacings for each layer must be entered into the CAD system This is typically done in tabular form 1464 Netlists Netlists describe to the CAD system how the pins of each device connect to each other.

Systems that manage routing or layout to high-speed design rules will require netlists that contain instructions on how to handle each net, such as what impedance to use, what spacing to preserve with respect to neighbors, and whether terminations or special ordering is needed 1465 Parts Lists Parts lists tell the CAD system what type of library entry to use for each part in the design..

0. 0 37 5 0. 75 1. 12 5 1. 1. 5 87 5 2. 25 2. 62 5 3. 3 37 5 3. 75 4. 12 5 4. 5 4. 87 5 5. 25 5. 62 5 6. 6 37 5 6. 75 7. 12 5 7. 5 7. 87 5 8. 25 8. 62 5 9. 9 37 5 9. 75

0.05

0.1

1. Before beginning your presentation, what should you avoid drinking (a) Carbonated beverages (b) Milk (c) Alcohol (d) All of the above 2. Before a presentation, what should you focus on (a) What can go wrong, so you can x it (b) Bad speaking experiences from the past (c) Memorizing your material (d) A positive outcome 3. Which condition is not a sign of stage fright (a) Deep breathing (b) Cold hands (c) Dry throat (d) Blushing 4. What is the most effective way to practice your presentation (a) Go over it in your head. (b) Practice from the beginning to the end. (c) Use a video camera to record your practice sessions. (d) Speak while looking into the bathroom mirror. 5. What is an outcome of memorizing your presentation (a) It makes the talk sound natural. (b) It is a good way to learn everything you need to say. (c) It makes it easy to lose your place in the material. (d) It helps you get your points across.

FIGURE 42.13 An excellent example of a good I Sn deposit s gradual decline in solderability performance as a function of intermetallic growth over 716 days. The wetting times increase slightly, which is also as a function of SnO growth on the surface of the deposit.

(1 + 1 2 )2

with test times as a function of board thickness and copper weight. Any data generated from such experimentation should be submitted to the ANSI-JSTD-003 committee.

The majority of components require the use of some form of plating to provide solderability and shelf life very similar to what is needed for PCBs. There are myriad plating options, both from the metallurgy used to the application methods employed. Process control for component plating could be argued to be more critical than for PCBs due to the speed of plating and the number of components plated /hour as well as the various plating techniques and alloys. Prior to the RoHS directive, the component surface finish in the majority and of choice has been tin lead. Suitable for all plating applications from barrel to rack to strip, the plating of this surface finish was easily controlled; hence its solderability. The chemistry used in the majority was

0 37 5 0. 75 1. 12 5 1. 5 1. 87 5 2. 25 2. 62 5 3 37 5 3. 75 4. 12 5 4. 5 4. 87 5 5. 25 5. 62 5 6 37 5 6. 75 7. 12 5 7. 5 7. 87 5 8. 25 8. 62 5 6. 0. 3. 9. 9 37 5 9. 75

0.05

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FIGURE 42.14 A gradual reduction of wetting forces as a function of copper migration through the Direct Immersion Gold (DIG) deposit after 877 days in storage.