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initially formulated in the 1960s and may have seen some tweaking over the years for plating efficiency. In addition to the common place tin lead, exotic deposits such as nickel palladium, nickel gold, or palladium silver etc have also been used. While these deposits also offer extensive shelf life and excellent solderability performance, fear of gold embrittlement has resulted in the pre-tinning of gold plated devices prior to assembly to remove the gold from the component. The tinning process changes the solderability performance dramatically.

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Solderability of Component Basis Metal Unlike the PCB world where the basis metals used are inherently solderable, such as copper or nickel, the component world deals in basis metals that are non-solderable such as stainless steel or brass (solderable with fluxes not typically found in the electronics industry), marginally solderable (such as Alloy 42 a nickel iron alloy), to easily solderable (such as C194 copper alloy). This fact needs to be realized when designing with or choosing a metal or alloy for a given component and the simple question, Will this part solder if the surface finish application or quality is marginal needs to be asked. If the answer is no, as when using stainless

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steel for example, then great care will need to be exercised in both the process control and metallurgy chosen for the part If the answer is inherently yes then a greater process window should be expected It should be noted that testing and soldering with Pb-free alloys only acts to reduce any process window While this is a chapter on solderability and not necessarily metallurgy, it is important to point out a few factors that may have been missed in designing for component solderability 101 If these fundamentals are followed then the results obtained from solderability testing of components may make more sense and help you deal with problems on the line The following points should be followed to minimize solderability issues as a function of basis metal choice: 1.

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So can you help me Alex didn t know how to respond as he stood there staring at his client with a puzzled look on his face. As Maureen, his client, rambled about the new system and its installation, Alex had been daydreaming about how he d spend the commission check for last month s sale. He totally missed Maureen s comment about the minor malfunction that slowed down the new system. When he asked her to repeat the question, she became annoyed, and for the rst time, Maureen began to doubt her choice of vendors. Embarrassing situations like this have a high cost to salespeople, students, project managers, and spouses! Even though conversations aren t usually considered to be presentations, both involve exchanging information, and both require good listening skills to be successful. To be a good communicator, you must be a good listener. Check out this thought-provoking self-assessment: Listening Self-Assessment 1. Do you frequently daydream during meetings or presentations 2. If someone you respect makes a statement that you don t understand, do you hesitate to ask for clari cation

Is the basis metal solderable by itself when tested with the flux specified by the ANSI-JSTD002 Brass, stainless steel, and beryllium copper common basis metals for components will not solder as tested to the JSTD-002 C194 or C197, phosphorous bronze, alloy 42, thick film Ag, or Pd Ag are solderable 2 The ideal method to make a non-solderable basis metal solderable is to use either a barrier or intermediate metal that is solderable, such as nickel or copper A less ideal method, and one commonly used, is to plate a heavy deposit of tin lead or 100 percent tin over it and hope that sufficient plating remains post soldering 3 The use of thin deposits of a final finish, over a non-solderable basis metal, may result in initial wettingThis is followed by de-wetting when the surface finish is consumed by the tin in the solder 4.

If soldering to a surface finish, plated over a non-solderable basis metal, the reliability of the solder joint will be a function of the adhesion capability of the plating to the basis metal Even if a good solder joint is formed between the assembly alloy and the component surface finish, the reliability will be poor if the plating peels from the surface The reliability of the component will be placed firmly back into the plating process and the surface preparation by the plater You should ask yourself if you trust your plater and the consistency of the process 5 The preferred method for dealing with a non-solderable basis metal is to plate with a solderable metal Adhesion of this plating to the basis metal is critical.

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