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ENIG This finish is widely used because it provides a very flat surface for surface-mount component placement. It has good solderability and a long storage life but is somewhat expensive compared to other finishes. Careful control of the gold plating process during board fabrication is required to prevent a defect known as black-pad. Black-pad is caused by galvanic corrosion of the nickel layer, creating corrosion products that affect the ability of the surface to be wet with solder. If severe enough, black-pad will impact reliability of the final solder joint. ImAg Immersion silver provides a flat surface with good solderability and storage life. It is also less expensive than ENIG. However, the ImAg finish is prone to tarnish under certain atmospheric conditions; in the presence of sulfur, it forms sulfides that darken the surface and reduce solderability. OSP Organic solder preservatives are inexpensive and also provide a flat surface for surfacemount technology (SMT) placement. Storage life for OSP is less than for the metallized finishes, and multiple thermal cycles cause it to degrade. HASL One of the oldest surface finishes, HASL is based on exposing the PWB to molten solder and then removing excess solder using hot-air knives. In the lead-free world, the processing temperature is higher than for tin-lead. HASL is inexpensive, has good solderability if the solder is sufficiently thick, but has the disadvantage of not being a flat surface. ImSn This finish is similar to immersion silver in most characteristics. However, because tin tends to form metallic whiskers that can cause electrical shorts, it is not widely used.

Component Surface Finishes Component surface finishes, like those of substrate finishes, are intended to provide good solderability. In the past, the majority of component leads had a tin-lead solder finish. This finish was either plated on the base metal of the component or was applied by dipping the leads in liquid metal. Given the push for lead-free assembly, most of these finishes containing lead are being replaced by alternatives. The main contenders in replacement of lead containing finishes are based on noble metals (e.g., palladium or gold) or some form of tin plating. Palladium finishes have been in use for many years and are a known commodity. However, as noted previously, the tendency of tin to form metallic whiskers as a result of stresses in the plated layer is a matter of serious concern for the electronics industry.

Soldering3 is defined as the process of joining metallic surfaces with solder without melting the basis metal. For this joining to take place, the metal surfaces must be clean of contamination and oxidation. This cleaning action is performed by the flux,2 a chemically active compound that, when heated, removes minor surface oxidation, minimizes oxidation of the basis metal, and promotes the formation of an intermetallic layer between solder and basis metal. The soldering flux has several functions to perform. It must:

React with or remove oxide and other contamination on the surface to be soldered Dissolve the metal salts formed during the reaction with the metal oxides Protect the surface from reoxidation before soldering occurs Provide a thermal blanket to spread the heat evenly during soldering Reduce the interfacial surface tension between the solder and the substrate in order to enhance wetting

To perform these functions, soldering flux formulations contain the following types of ingredients: vehicle, solvent, activators, and other additives.

Vehicle The vehicle is a solid or nonvolatile liquid that coats the surface to be soldered, dissolves the metal salts formed in the reaction of the activators with the surface metal oxides, and, ideally, provides a heat transfer medium between the solder and the components or PWB substrate. Rosin, resins, glycols, polyglycols, polyglycol surfactants, polyethers, and glycerine are among the major chemicals used. Rosin or resins are selected when more benign chemicals are required since their residues are less apt to cause reliability failures. Glycols, polyglycols, polyglycol surfactants, polyethers, and glycerine are used in water-soluble flux formulations because they provide excellent wetting of the board surface and dissolve the more active materials used in these formulation.

Solvent The solvent serves to dissolve the vehicle, activators, and other additives. It evaporates during the preheat and soldering process. The solvent chosen depends upon its ability to dissolve the flux constituents for a given formulation. Alcohols, glycols, glycol esters, glycol ethers, and water are common solvents used.

Activators Activators are present in the flux formulation to enhance the removal of metal oxide from the surfaces to be soldered. They may be reactive at room temperature, but their activity is enhanced as the temperature is raised during the preheat step of the soldering process. Among the common activators found in flux formulations for traditional soldering fluxes are amine hydrochlorides; dicarboxylic acids, such as adipic or succinic; and organic acids such as citric, malic, or abietic. Higher molecular weight activators are needed for lead-free soldering. Activators containing halide and amine give excellent soldering yields but may cause reliability problems if not properly removed in a well-controlled cleaning step. The halides may be present in either ionic or non-ionic form depending on the level of activation desired. Ionic activators provide, in general, a higher level of activation for a given halide content.

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