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Other Additives Soldering fluxes often contain small amounts of other ingredients that serve a specialized function. For example, a surfactant may be added to enhance the wetting properties. This constituent can also assist in the foaming characteristics required for foam flux application. Other additives may be included to lower the interfacial surface tension between the molten solder and the PWB as it exits the solder wave, decreasing the chance for solder bridges to form. Solder paste formulations require the presence of additives to provide good viscosity or flow characteristics, low slump during the preheat step, and good tack characteristics for holding the component in place until reflow occurs. Finally, cored-wire flux used for hand-soldering contains a plasticizer to harden the flux ingredients that are present in the core of the wire.

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Flux and Temperature Issues The flux becomes active as it is heated. In traditional flux chemistry for Sn/Pb solder, the assembly is preheated to around 100 to 125 C to remove the solvent and begin to activate the chemicals used to remove the metal oxide. After this plateau, the temperature is increased above the melting point of the solder (183 C) to 240 C for sufficient time to reflow the solder paste, and then the assembly is cooled, solidifying the solder and creating a metallurgical bond between the board metallization and the components. For lead-free soldering, the preheat plateau temperature is higher 150 to 200 C and the peak temperature is 245 to 260 C. This requires solvents that evaporate at a higher temperature and activators that become chemically active at a higher temperature. In addition, new activators are needed to address the new metallurgy on board surfaces and new lead-free solders containing Ag, Cu, and much higher levels of Sn. The decrease in pitch for area-array packages has resulted in a need for finer solder powders. This is driving a change in paste flux chemistry since the higher surface area of these fine powders results in increased oxide formation and decreased paste stability.

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Although one usually thinks of soldering flux as a liquid, in fact the soldering flux can exist in several different forms. Liquid flux is commonly used for wave-soldering or hand-soldering applications. Paste flux, a thick, viscous flux, is used to hold components to the board prior to reflow of the already present solder. Direct attachment of a solder-bumped chip or BGA packages to solder pads on a PWB is an example of paste flux s usefulness. Also known as tacky soldering fluxes, these materials are useful in repair of area-array devices. Solder paste contains solder paste flux, which is the solder paste without the solder particles. Solder paste is used in surface-mount attachment of components such as chip carriers, quad flat packs (QFPs), BGAs, m-BGAs, CSPs, leaded packages, and discrete resistors and capacitors. Fluxcored solder wire is used for hand-soldering, and flux-coated or flux-cored solder preforms are used as the solder/flux source in some applications such as backplane connector pin reflow soldering. Fluxing underfills can also be considered as a new type of flux material. Many fine-pitch, low-profile array packages suffer from poor reliability due to their low standoff from the substrate, small area of solder interconnection and CTE mismatch with the substrate. Often, a reinforcing material is dispensed around the solder joints after assembly to improve attachment reliability. Fluxing underfills provide fluxing action for the solder process and cure into a hard supporting material during the soldering process, eliminating the need for a post-solder dispensing step.

Early flux formulations for electronics used rosin, which is a naturally occurring resin, obtained from the sap of a pine tree Its exact composition varies depending on the part of the world from it originates as well as the time of the year Rosin contains a mixture of resin acids, the two most common ones being abietic acid and pimeric acid (see Fig 431) Rosin has been a favorite material for soldering because it liquefies during the soldering process, dissolves the metal salts, and then solidifies when cooled, entrapping and for the most part immobilizing the contaminants In addition, rosin has some innate fluxing activity since its molecular structure contains a weak organic acid Finally, rosin-based fluxes work well in hand-soldering and repair operations because rosin provides good heat transfer characteristics.

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crystal reports pdf 417

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crystal reports pdf 417