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Although these chapters will give great emphasis to Pb-free solders and soldering, it is best to demonstrate soldering process dynamics with Sn-Pb solder, for a couple of important reasons: first, it is our best understood metallurgical system, and second, it is a binary alloy with predictable bonding attributes. It will benefit the reader first to have a good understanding of this

relatively simple alloy system. The case presented will be based upon eutectic Sn-Pb solder (63 wt percent Sn and 37 percent Pb) in contact with solderable and non-solderable coatings on a basis metal. Primary soldering steps include:

Intimate contact of the solder to materials being joined Slow application of heat to warm the parts to be soldered Oxide removal from the joining surfaces and solder metallurgies Application of heat sufficient to melt the solder Solder wetting to joining surfaces and intermetallic formation Quenching of the solder liquidus

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There are a few other materials that need to be covered for this discussion. The first is solder paste. This is a mixture of minute solder beads, flux, and other materials to give it specific rheological characteristics for dispensing and chemical agents for metal surface preparation. For surface-mount applications, it is typically stenciled onto PWB bonding pads, and then the electronic component is placed upon the solder paste deposit. The paste holds the component in place during the reflow process. The second is flux, which, as mentioned previously, is a key component of solder paste. The flux is a heat-activated chemical agent used to clean solderable surfaces. Both paste and flux will be covered in subsequent sections of this chapter.

Intimate Contact of Solder to Surfaces to Be Joined This is the most basic of requirements. The solder has to be in contact with the materials to be joined. The contact area of the solder is not wholly important as long as the solder is in point contact with the surface to be soldered when it reaches liquidus. Surface tension effects and metallurgical wetting will complete the spreading of solder contact.

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such a diagram is then described by lines that make a 45 angle with the x-axis, i.e., lines that satisfy t2 = x2 In the rst quadrant, the paths of light rays are described by the lines t = x. The motion of a particle through spacetime as depicted in a spacetime diagram (Fig. 1-4) is called a worldline. The simplest of all particle motion is a particle just sitting somewhere. To indicate the worldline of a stationary particle on a spacetime diagram, we simply draw a straight vertical line that passes through the x-axis at the spatial location of the particle. This makes sense because the particle is located at some position x that does not change, but time keeps marching forward.

Slow Heating of Boards and Parts to Be Soldered This is important for three main reasons. First, overly rapid heating can cause certain parts to experience thermal shock and subsequent failure as in cracking or may cause degradation of device electrical characteristics. Second, solder paste may spatter if heated too rapidly. Last, appropriate heating rate is crucial to good surface preparation through fluxing. Balance between time and temperature has to be determined so that the flux has enough time to accomplish its cleaning step and does not dry out prematurely or spatter. Prolonged heating cycles can also cause re-oxidation of flux cleaned parts. The following subsection covers fluxing more thoroughly.

Oxide Removal from Bonding Surfaces and from Solder Most materials, when in equilibrium with our oxygen-rich environment, develop an oxide coating. Upon heating, solder surfaces as well as the bonding surfaces will more thoroughly oxidize in a normal air environment. If a silver-bearing surface is exposed to a sulfur-containing ambient (sulfur-tainted air), sulfidation occurs and that tarnish also inhibits soldering. Generally, the higher the storage temperature, the more oxidation is present unless oxide growth is self-limiting, as it is in some materials. The same holds true for soldering process temperature or process time. The longer and hotter, the more oxidation or tarnish is a problem if there is no flux or if the process renders the flux ineffective such as by overheating.

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