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Oxides and tarnishes act as a physical barrier preventing alloy formation between the solder and the metal to be soldered. In the case of gold (Au), known to remain largely oxide-free, there is insufficient oxidation to degrade soldering. But unless oxidation is removed from the solder itself, solder alloying with the Au may not be possible or will be incomplete. Note that in most soldering processes, the ambient can be altered to mitigate the detrimental effects of oxygen or other airborne contaminants. This will be discussed later. The most generally applied remedy for the effects of oxidation and tarnish as relates to the soldering process is the application of a chemical agent, flux. It is formulated to react with specific metallurgies and removes tarnish and oxidation. It also acts as a barrier preventing fluxed metal surfaces from re-oxidizing prior to and during the joining process. The word flux comes from the Latin fluxus, which means flow or flowing. Flux ensures that the solder, once molten, will flow over the surfaces to be bonded, unconstrained by oxide skins on the solder or the metals to be joined. Certain materials form oxides very rapidly, and some oxides are rather chemical-resistant. Nickel is one such element. Copper, like nickel, can also form resistant oxides and may necessitate the use of strong fluxing agents to achieve a bondable surface. Tin and silver oxides are easily attacked by even weak organic acids. Gold, which is known to remain oxide-free, can be applied as a thin, nonporous barrier over less noble, oxide-stripped metals such as nickel. During reflow, the gold dissolves quickly into the solder and the solder bonds to the underlying oxide-free nickel. Figure 44.1 shows the difference between a solder wettable surface and a flux-resistant oxide-coated surface.

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Good wetting on Cu (a)

No wetting on Ni (b)

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Check digit - Wikipedia
EAN (European Article Number) check digits (administered by GS1) ... first odd position is the last digit in the code . ... that the mechanism for GTIN- 13 is the same ...

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EAN13CheckDigit (Apache Commons Validator 1.6 API)
public final class EAN13CheckDigit extends ModulusCheckDigit. Modulus 10 EAN - 13 / UPC / ISBN-13 Check Digit calculation/validation. Check digit calculation is based ... Methods inherited from class java .lang.Object · clone, equals, finalize ...

FIGURE 44.1 Comparison of soldering to copper (a) and nickel surface (b) with a weak organic solder flux. Note that in the case of the copper surface, the solder has wet and spread, characterized by a low wetting angle (the extent of wetting is indicated by the dashed outline). In the case of the nickel surface, the flux was ineffective in penetrating the oxide layer and solder was not able to wet to it. Instead, the solder beaded up on the surface of the nickel. (Courtesy of Hewlett-Packard.)

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EAN13 . java · GitHub
Scanner console = new Scanner(System.in);. System.out.println("This program will take the first 12 numbers of a EAN13 barcode and compute the check number ...

Several types of fluxes are available for soldering, but only two broad categories are in widespread use. The first is aqueous-clean, also known as water-clean flux. This is generally composed of relatively strong organic acids and may be fortified with halogens to increase its chemical activity. Aqueous-clean formulations are meant to be thoroughly washed from the surface printed circuit assembly after soldering. If left on the board, corrosion products will form and cause corrosion and electrical failure. There are several electrical components that make aqueous-clean chemistry less attractive. These include dual inline package (DIP) switches, sealed switches (which are known to leak), high-density connectors, large area-array packages, micro-BGAs, and any other components with low headroom between the underside of the package and the surface of the PWB. It is for this reason, plus the opportunity to eliminate an expensive and vagarious process step (aqueous-cleaning) and associated equipment, that the vast majority of electronics manufacturers have widely embraced no-clean soldering fluxes.

The second is rosin-based, with additives to make it chemically active to varying degrees. Removal requires solvent, but it can be formulated so that the residue is inert and can remain on the board. This is termed no-clean flux.

Heating to Liquidus Once heated to melting, solder begins to form a metallurgical bond with contacted metals if wettable by dissolution and alloy formation.After the process starts, it progresses slowly, causing the solder to spread as it dissolves surfaces and alloys with it. The molten solder is drawn by surface tension to fill fine capillaries, and surface tension causes the solder to flow across wettable surfaces to some extent, forming webs of solder known as fillets. The solder fillet acts as a mechanical gusset imparting strength to the resultant solder joint.

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Barcode4J is a flexible generator for barcodes written in Java . ... Codabar; UPC- A and UPC-E (with supplementals); EAN - 13 and EAN-8 (with supplementals) ...

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