rdlc data matrix

rdlc data matrix

rdlc data matrix

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with lower operating frequencies and slower rise and fall times. The voltage and ground distribution and the location and type of bypass capacitors can have a significant impact on EMC and electrical signal integrity. 15.5.3.1 Grounding Concepts. Electrical grounding is one of the most important concepts and probably the least understood aspect of electrical signal integrity and EMC. All electrical conductors, including ground, form very subtle, but active, electrical interconnection network that can significantly compromise the product definition s requirements for electrical signal integrity and EMC. In particular, the grounding system is critical to ensure compliance to functional performance and regulatory requirements. Grounding (and voltage distribution) concepts are a matrix of requirements, concepts, concerns, considerations, and practices. In general, there is no universal solution suitable for all applications. Grounding is considered by some to be an art, which can be supported in that some grounding systems are completely unstructured and the reasons that some systems work, while others do not, are not clear. As a result, there has been an ongoing search to find a set of rules that can be used for the design of grounding systems and, unfortunately, many of the rules are conflicting. For example, a modular modem PCMCIA electronic assembly may have a suitable grounding system for normal telecom line operation. Yet, this may be totally inadequate if a 100-1kA electrical current, coupled through the PCMCIA assembly into the personal computer s electrical grounding system, is induced in the telecom line due to a nearby lightning strike or fallen power line. Similarily, a suitable electrical safety grounding system for power line frequencies may not be suitable near a high-power, high-frequency radio, television, or telecommunications transmitter. The following are some of the major concerns and considerations that are involved in good grounding practices:

Integration of analog and digital signal converters, especially with more than 12 bits of resolution ground loops and noise High-speed and high-frequency operation ground pull-up and EMC High-speed and high-frequency bus line drivers and receivers major ground pull-up and EMC concerns Low-signal-level analog sensors (transducers) Length of the conductors in the voltage/grounding system as a considerable portion of the electrical wavelength of one of the frequencies of the signal range of EMC When designing a grounding system, consideration of developing a grounding map that identifies all grounding requirements and voltage/current/frequency requirements

15.5.3.2 Grounding Systems. The following is an introduction to several grounding and voltage distribution systems and their electrical characteristics. Single-Point and Point-Source Grounding Concepts. Single-point grounding is a method whereby the grounding electrical interconnection network is connected to ground at a single point at either the source or load end of the electrical interconnection network. The voltage drops between the various grounding nodes is a function of the interconnection network impedances, operating frequency, and current. Point-source or star grounding systems have a single-point grounding location for all electrical loads. The point-source grounding point is connected to another grounding point using a low-impedance bus or grounding conductor. Multiple-Point Grounding Concepts. A multiple-point grounding system may be in the form of a loop or tree-like structure. In a loop grounding system the voltage drops around the loop may vary, depending on the electrical characteristics of each of the loads attached to the grounding loop. In a tree, the grounding system has good voltage regulation and allows leads to be independently attached or removed from the tree without a significant impact on the remaining loads. Ground Planes. Ground planes are the grounding system of choice for most serious PCD requirements. Ground planes can improve the electrical signal integrity of the grounding system

In a simplistic sense, the soldering process model is generally treated as solid and liquid metals interfacing with a gas (the soldering ambient). However, realities dictate a modified view. Nearly all metals oxidize when exposed to air and these oxides, whether on the solder itself or on the metals to be joined, always impede soldering. To keep the solder and surfaces to be joined bondable, the oxide must be removed and bonding surfaces must be kept oxide-free until soldering is complete. A chemical fluxing agent is used to this end and is indispensable to the process of joining. Fluxes are tailored to both the metals to be joined and soldering process temperature. Some metal oxides such as aluminum and nickel have chemical-resistant oxides, which make soldering difficult. Even copper oxides can be tough to dissolve. Most fluxes used in printed circuit assembly are acid-based and are formulated to be strong or weak depending on the metal systems to be joined, post-soldering treatments, and reliability needs. Fluxes are typically composed of acids and high molecular weight materials that are slow to dry, slow to evaporate, and slow to decompose. They are often so acidic that they can etch, dissolve, or disrupt oxides and tarnishes on solder and surfaces to be joined. Both the absence and presence of liquid flux have an effect on the extent of solder wetting. Some fluxes can transition from a runny liquid during preheat to a viscous liquid or gel and ultimately to a gummy solid as it dries out, polymerizes, and decomposes during the soldering cycle.