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During the soldering process, the alcohol or other volatiles in the flux begin to evaporate and the rosin-based solids precipitate The solids soften at low temperatures (50 to 70 C) and begin to flow, covering the surfaces to be fluxed With higher temperatures come higher reactivity and oxides and other tarnishes are stripped, readying surfaces for solder wetting The most widely used fluxes today are resins but act in the same fashion Generally weak organic acid activators such as succinic, malonic, and adipic acids are added to increase the reactivity of the flux These, too, volatilize or decompose during the reflow cycle and only a clear polymerized, non-corrosive residue is left on the board The need for cleaning this residue is absent, hence the term no-clean.

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The best additives are ones that will not evaporate or decompose too early in the heating cycle but will completely volatilize or decompose at or near the peak temperature of the soldering process Halogenated activators should be avoided with no-clean chemistries Some high-temperature organic acids may not completely volatilize or decompose, so reliability testing of the flux residues should be conducted to ensure that corrosion will not impact product reliability Besides adding activators, one can boost a flux s chemical reactivity by increasing the rosin or resin content, but the higher the rosin/resin content, the heavier the post-soldering flux residue Pure rosinic residues, especially from high-rosin-content formulations, are benign, hydrophobic, and electrically insulating, but they tend to be sticky..

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Benefits of No-Clean No-clean benefits include lower manufacturing costs through fewer process steps, less board handling, less maintenance, and reduced floor space than is required for board assembly via water-soluble fluxing. There are also environmental benefits of no-clean, as there is almost no waste effluent other than from the solvent within the paste or flux that evaporates during the process and from solvents used to clean the stencil, squeegee blades, and any misprinted boards.

We can re ne this equation further using our previous results. Using (8.3) together with (8.4), we nd X = sin cos = (sin2 cos2 ) We also have X = f ( ) f ( ) d + g ( ) f d + g( )

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This represents an extreme reduction in waste stream to the environment as compared to the use of water-soluble paste and flux There are volatile organic compound (VOC) free no-clean formulations that make no-clean even more environmentally friendly and attractive These are generally compounded with a water or water-soluble solvent instead of alcohol 4662 The Negatives of No-Clean Before talking about the negatives of no-clean, it should be understood that the no-clean approach to circuit board assembly is widely embraced and is the mainstay of the industry Any negatives of this technology are counterbalanced by major benefits No-clean is impractical for only a small number of niche applications 46621 Difficulty of Inspection No-clean residues, especially from surface-mount technology (SMT) soldering, are generally hard, transparent polymerized deposits that interfere to some degree with solder-joint inspection.

The deposit can crack and sometimes operators will mistake the cracked flux residue deposit for solder-joint cracking The residue is also reflective, which can interfere with visual inspection or automatic optical inspection (AOI) methods 46622 Decrease in Barrel Fill at Wave Soldering Since no-clean fluxes are weaker fluxing agents than water-soluble formulations, wave soldering is a somewhat less robust process Poorer barrel fill is generally found with no-clean fluxes, although in most cases subtle changes to the wave solder machine configuration and wave solder time-temperature profile are sufficient to gain excellent or acceptable plated through-hole (PTH) barrel fill 46623 ICT Probe Noncontact Much of the no-clean flux residue associated with wave soldering of the secondary side of the board is washed off by the molten solder during the wave solder operation.

Coach Yourself to Presentation Success by Dianne M Kipp, BSN, PCC Con dence to stand in front of an audience does not arrive with us at birth Most of us have to read a book such as this one or take a course in public speaking to improve our comfort level and hone our speaking prowess Organizations like Toastmasters exist purely in response to the great demand resulting from most people s discomfort with presenting to an audience of any size It takes courage to become the center of attention and to step outside our comfort zone Take heart! Here are a few steps that will decrease the stress and increase the fun you might have as a presenter Mental Preparation: Demystify the Fear Factor 1 F E A R isn t FEAR the main cause of our discomfort Think about this.

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